Name: APT1: Assembly Process & Materials 1
Start: 2021-11-03T11:00:00-0500
End: 2021-11-03T12:30:00-0500

APT1: Assembly Process & Materials 1

Chair: Pradeep Lal, Ph.D., Auburn University

>>Innovative Indium and Silver-Tin Plating Processes for Connector Press-Fit Applications
Frank Xu, Ph.D., Macermid Alpha Electronics Solutions

>>Micro Device Hot Solder Dip: Assessing the Validity of Self-Mitigation in Micro Components
Phil Myers, Retronix Ltd

>>No Bleed Die Attach to Roughened Leadframe
Dan Hart, MacDermid Alpha Electronics Solutions

Speakers

Conference Sessions, APT Track

SMTA International 2021

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Frank Xu, Ph.D.

Dan Hart

Phil Myers