Automotive platforms increasingly use electronics for a number of function-critical and safety critical functions including guidance, navigation, control, charging, sensing and operator interaction. The automotive platforms have evolved over the last two decades to include hybrid electric vehicles and fully-electric vehicles. Much of the electronics resides under the hood of the car, where the temperatures and vibration-levels are much harsher than experienced in consumer office-benign applications. The space of packaging applications has continued to evolve through the emergence of new packaging architectures to enable for advanced computing on mobile automotive platforms. In addition, new materials and integration processes have emerged to allow for ever tighter integration of electronics sensing and processing into the structural features of the automotive body. The real-time environment for enablement of advanced features creates a set of challenges unique to the automotive platform. The panel is constituted of a team of subject-matter experts from industry and academia who will talk about the challenges related to packaging in challenging automotive applications.
