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Tuesday, November 2 • 8:30am - 10:00am
SLIR1: Adoption of Pb-free Solder Assembly for the Aerospace and Defense Industry

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Chair: Richard Coyle, Ph.D., Nokia Bell Labs

>>Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 1
*David Hillman, Collins Aerospace

>>Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 2
*Anthony Rafanelli, Ph.D., RaytheonTechnologies

>>Criteria for Solder Alloy Adoption
Michael Osterman, Ph.D., University of Maryland - CALCE

Speakers
avatar for David Hillman

David Hillman

Collins Aerospace
AR

Anthony Rafanelli, Ph.D.

Raytheon Technologies
MO

Michael Osterman, Ph.D.

University of Maryland - CALCE


Tuesday November 2, 2021 8:30am - 10:00am CDT
Room 200 E