Chair: Dave Hillman, Collins Aerospace Co-Chair: Grace Cooke, Collins Aerospace
>>A Novel Bismuth-, Indium-, and Antimony-Containing Lead-Free Solder with Enhanced Thermal Reliability for Automotive and LED Jie Geng, Indium Corporation
>>High-Reliability Lead-free Solders for Automotive Electronics - Thermal Cycling and Shear Strength Performance Paul Salerno, MacDermid Alpha Electronics Solutions
>>Reliability of Solder Joints on Flexible Aluminum PC Boards Divyakant Kadiwala, Nazarali Merchant, Averatek Corporation
>>Reducing Solder Scrap by Replacing Solder Paste with Solder Preforms When Appropriate Mitch Holtzer, MacDermid Alpha Electronics Solutions
