Loading…
Wednesday, November 3 • 2:00pm - 3:30pm
TI1: Thermal

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

Chair: Julie Silk, Keysight Technologies

>>High Performance Liquid Metal Thermal Interface Materials
Ron Lasky, P.E., Ph.D., Indium Corporation

>>GaIn Based Liquid Metals as TIMs: Challenges and Considerations
Peter McClure, Universal Instruments Advanced Process Laboratory

>>Photonic Soldering Temperature Sensitive Components with High Temperature Solder Alloys
Vahid Akhavan, NovaCentrix

Speakers
avatar for Ron Lasky, P.E., Ph.D.

Ron Lasky, P.E., Ph.D.

Indium Corporation
PM

Peter McClure

Universal Instruments’ Advanced Process Laboratory
VA

Vahid Akhavan

NovaCentrix


Wednesday November 3, 2021 2:00pm - 3:30pm CDT
Room 203A&B