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Monday, November 1
 

11:00am CDT

Registration Opens
SMTA International Registration - Monday, November 1
11:00am-5:00pm
Foyer of Hall B

Monday November 1, 2021 11:00am - 11:00am CDT
Hall B
 
Tuesday, November 2
 

7:30am CDT

Registration Opens
SMTA International Registration: Tuesday, November 2 - Thursday, November 4
7:30am-5:00pm
Foyer of Hall B

Tuesday November 2, 2021 7:30am - 5:00pm CDT
Hall B

8:30am CDT

FSA1: Reliability Enhancements
Chair: Andy Behr, Panasonic

>>Edge Bonding as Viable Reinforcement for Solder Joints in High Reliability Applications
Westin Bent, MacDermid Alpha Electronics Solutions

>>Deliquescent Relative Humidity Measurement of No-Clean Flux Residues
Eric Campbell, IBM Corporation

>>A Correlation Study of Solder Cup Voiding Versus Solder Joint Integrity
*Timothy Pearson, Collins Aerospace

Speakers
WB

Westin Bent

MacDermid Alpha Electronics Solutions
EC

Eric Campbell

IBM Corporation
TP

Timothy Pearson

Collins Aerospace


Tuesday November 2, 2021 8:30am - 10:00am CDT
Room 203A&B

8:30am CDT

MFX1: Process Development & Reliability
Chair: William Capen, Honeywell FM&T

>>The Evolution of Material Handling Practices and Processes
Michael Adamson, Inovaxe Corporation

>>Statistical Analysis of Transfer Efficiency in the Age of Very Large Sample Sizes
*Ron Lasky, P.E., Ph.D., Indium Corporation

>>The Effect of Grain Size Distribution on the Defect Generation Mechanism of 0201 Passives
Swagatika Patra, Binghamton University-SUNY

Speakers
MA

Michael Adamson

Inovaxe Corporation
avatar for Ron Lasky, P.E., Ph.D.

Ron Lasky, P.E., Ph.D.

Indium Corporation
SP

Swagatika Patra

Binghamton University-SUNY


Tuesday November 2, 2021 8:30am - 10:00am CDT
Room 200 D

8:30am CDT

SLIR1: Adoption of Pb-free Solder Assembly for the Aerospace and Defense Industry
Chair: Richard Coyle, Ph.D., Nokia Bell Labs

>>Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 1
*David Hillman, Collins Aerospace

>>Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 2
*Anthony Rafanelli, Ph.D., RaytheonTechnologies

>>Criteria for Solder Alloy Adoption
Michael Osterman, Ph.D., University of Maryland - CALCE

Speakers
avatar for David Hillman

David Hillman

Collins Aerospace
AR

Anthony Rafanelli, Ph.D.

Raytheon Technologies
MO

Michael Osterman, Ph.D.

University of Maryland - CALCE


Tuesday November 2, 2021 8:30am - 10:00am CDT
Room 200 E

10:30am CDT

FSA2: Flux Performances
Chair: Andy Behr, Panasonic

>>An Investigation into the Effects of Greases on Low-Load Gold-Plated Electrical Contacts Undergoing Fretting
Julie Silk, Keysight Technologies; Rishabh Chaudhary, M.S., Center for Advanced Life Cycle Engineering (CALCE)

>>Lower Temperature Soldering Using Supercooled Liquid Metal
Ian Tevis, SAFI-Tech

>>Materials Characterization and Correlation Study of Solder Paste using Electrochemical Impedance Spectroscopy (EIS) and Surface Insulation Resistance (SIR)
*Mark McMeen, STI Electronics

Speakers
RC

Rishabh Chaudhary, M.S.

Center for Advanced Life Cycle Engineering (CALCE)
IT

Ian Tevis

SAFI-Tech
MM

Mark McMeen

STI Electrionics


Tuesday November 2, 2021 10:30am - 12:00pm CDT
Room 203A&B

10:30am CDT

MFX2: Cleaning
Chair: Jason Keeping, P. Eng., Celestica Inc.

>>Modern Electronics Defluxing – Meeting the Low VOC Challenge
Naveen Ravindran, M.S.Ch.E., ZESTRON Corporation

>>The Relationship Between Reflow Profiles and Contamination
*Michael Konrad, Aqueous Technologies

>>Engineered Aqueous Cleaning It All Comes Down To Performance
*Debbie Carboni, KYZEN Corporation

Speakers
NR

Naveen Ravindran, M.S.Ch.E.

ZESTRON Corporation
avatar for Mike Konrad

Mike Konrad

Aqueous Technologies
avatar for Debbie Carboni

Debbie Carboni

Global Product Manager, KYZEN Corporation
I love helping others!   Much of my time is helping OEM’s and their CM’s discuss "Design For Cleaning" & setting up their cleaning process to ensure reliability.  Solving problems helps us all learn!


Tuesday November 2, 2021 10:30am - 12:00pm CDT
Room 200 D

10:30am CDT

SLIR2: Predictive Modeling
Chair: Tim Pearson, Collins Aerospace

>>A Modified Coffin-Manson Methodology for Predicting Solder Joint Life in Eutectic Tin-Lead and Lead-Free Assemblies
*Jean-Paul Clech, Ph.D., EPSI Inc.

>>Low-temperature Solders SMT Process Optimization for Enhanced Reliability
Paul Salerno, MacDermid Alpha Electronics Solutions

>>An Investigation on the Influence of Nickel Contamination of Plated Through Hole (PTH) Solder Joint Integrity
*David Hillman, Collins Aerospace

Speakers
PS

Paul Salerno

MacDermid Alpha Electronics Solutions
avatar for David Hillman

David Hillman

Collins Aerospace


Tuesday November 2, 2021 10:30am - 12:00pm CDT
Room 200 E

1:00pm CDT

MFX3: Cleaning
Chair: Keith Howell, Nihon Superior

>>Cleanliness Detection and Resistance of Solvent Extract, A Critical Evaluation
Tom Forsythe, KYZEN Corporation

>>Identifying Cleaning Compatibility Issues with Electronic Components
Claire Brennan, Ph.D., Collins Aerospace

>>Detailed Study of Condensate Residues in the Soldering Process - Analysis of the Responsible Reaction Partners as well as Reasons for Condensate Polymerization and Growth of Crystalline Structures
Viktoria Rawinski, Rawinski GmbH

>>Site-Specific Ionic Contamination Process Control Monitoring Plan Method
*Mike Bixenman, DBA, MBA, Magnalytix

Speakers
TF

Tom Forsythe

KYZEN Corporation
CB

Claire Brennan, Ph.D.

Collins Aerospace
VR

Viktoria Rawinski

Rawinski GmbH


Tuesday November 2, 2021 1:00pm - 3:00pm CDT
Room 200C

1:00pm CDT

SLIR3: PB-Free Process Innovations
Chair: Dave Hillman, Collins Aerospace
Co-Chair: Grace Cooke, Collins Aerospace

>>A Novel Bismuth-, Indium-, and Antimony-Containing Lead-Free Solder with Enhanced Thermal Reliability for Automotive and LED
Jie Geng, Indium Corporation

>>High-Reliability Lead-free Solders for Automotive Electronics - Thermal Cycling and Shear Strength Performance
Paul Salerno, MacDermid Alpha Electronics Solutions

>>Reliability of Solder Joints on Flexible Aluminum PC Boards
Divyakant Kadiwala, Nazarali Merchant, Averatek Corporation

>>Reducing Solder Scrap by Replacing Solder Paste with Solder Preforms When Appropriate
Mitch Holtzer, MacDermid Alpha Electronics Solutions

Speakers
JG

Jie Geng

Indium Corporation
PS

Paul Salerno

MacDermid Alpha Electronics Solutions
DK

Divyakant Kadiwala

Averatek Corporation
MH

Mitchell Holtzer

Alpha Assembly Solutions


Tuesday November 2, 2021 1:00pm - 3:00pm CDT
Room 200 E

1:00pm CDT

Women's Leadership Program: Career Development Presentations and Guided Meditation Session
FREE for all attendees!

The past 18 months have been a time of reflection and transition for many of us. Many professionals are reassessing their career goals and career paths. In keeping with this trend, our 2021 WLP theme, “It’s good we are not all the same,” was chosen to encourage attendees to explore career transition options. The WLP this year will focus on the success stories of women who have created varied career paths, applying core technical strengths to a variety of areas and succeeding consistently. Hear how their diverse career experiences have contributed to their long-term success. Our two distinguished invited speakers have blazed unique career paths and will share their stories with the audience. We will conclude with a guided meditation session!

Information found here: https://smta.org/mpage/smtai-wlp

Tuesday November 2, 2021 1:00pm - 3:00pm CDT
Room 205 C&D

3:30pm CDT

SLIR4: Reliability Testing
Chair: Jean-Paul Clech, EPSI Inc.

>>Effects of Matching Lead-free Solder Joints Compared to SnPb on BGA Reliability in Thermal Cycling
Mohammed Belhadi, Auburn University

>>Role of Conformal Coating and Its Strategies for Tin Whisker Mitigation
Preeth Sivakumar, Binghamton University

Speakers
MB

Mohammed Belhadi

Auburn University
avatar for Preeth Sivakumar

Preeth Sivakumar

Binghamton University


Tuesday November 2, 2021 3:30pm - 4:30pm CDT
Room 200 E

3:30pm CDT

MFX4: Design and Process
Chair: Tom Borkes, The Jefferson Project

>>Process and Design Guidelines for Large and Complex RF and EMI Shields for Board Level Assembly
Ajay Chaddha and Mohammed Alam, Intel Corporation

>>Lessons Learned with Large and Heavy Copper Boards, a Review of Quality and Productivity Improvements
Paul Wilson, Rockwell Automation

>>Root Cause of Dye Stain Observed on Server Motherboard Sockets BGA Solder Joints and its Impact on their Solder Joint Quality and Reliability
*Raiyo Aspandiar, Intel Corporation

Speakers
MA

Mohammed Alam

Intel Corporation
PW

Paul Wilson

Rockwell Automation
RA

Raiyo Aspandiar

Intel Corporation


Tuesday November 2, 2021 3:30pm - 5:00pm CDT
Room 200 D

3:30pm CDT

Women's Leadership Program: Speed Mentoring with Table Tops
FREE for all attendees!

Speed Mentoring Sessions
Co-Chairs: Cheryl Tulkoff, National Instruments Corporation and Eileen Hibler, EAP

>>Breaking Through Unwritten Stereotypes: Good Old Boys Club
>>Identifying Mentors and Cultivating Sponsors
>>Importance of Strategic Thinking
>>Relentlessly Reinvent and Accelerate your Career Path
>>Positive Outcomes from Tough Situations
>>Find your Strengths: Personality Analysis

Tuesday November 2, 2021 3:30pm - 5:00pm CDT
Room 205 C&D

5:00pm CDT

Women's Leadership Connection Reception
FREE for all attendees!

Just like Ice Cream – It's good we're not all the same!

Ice cream comes in many flavors and everyone typically has a favorite or two. Think of how boring life would be if all of the ice cream in the world was vanilla with no sprinkles or toppings. There is nothing wrong with good ole vanilla, chocolate or strawberry but imagine a world without rocky road, pistachio or butter pecan! I shudder the thought. Come join us as we mingle and celebrate the different flavors of people in our industry. (Don’t be surprised to find a couple of nuts in the bunch.)


Tuesday November 2, 2021 5:00pm - 6:00pm CDT
Room 205 C&D
 
Wednesday, November 3
 

7:30am CDT

Registration Opens
SMTA International Registration: Tuesday, November 2 - Thursday, November 4
7:30am-5:00pm
Foyer of Hall B

Wednesday November 3, 2021 7:30am - 5:00pm CDT
Hall B

8:30am CDT

SMTA Annual Meeting & Keynote Session: Are You Ready for the EV Revolution?
FREE to All Attendees!


SMTA Annual Meeting
8:30am-9:00am
-------------------------------------
Keynote Presentation:
Are You Ready for the EV Revolution?
9:00am-10:00am
Loren McDonald, CEO
EVAdoption, LLC

The transition to electric vehicles (EVs) and away from gas-powered vehicles is clearly underway both around the world and in the US. Many key questions remain however, including how quickly the transition will occur (especially in America) and how disruptive the transition to EVs will be to various segments of the auto industry — from suppliers, to dealers and OEMs. In particular, the shift to EVs is turning the automotive supply chain on its head as lower barriers of entry are bringing many new players — both big and small — to the table.

In his keynote presentation, electric vehicle analyst and consultant Loren McDonald of EVAdoption will enlighten SMTA members on how and when the EV transition is likely to play out and outline both key challenges and opportunities for surface mount technology suppliers.

Speakers
avatar for Loren McDonald

Loren McDonald

CEO, EVAdoption, LLC
As CEO of EVAdoption, LLC, Loren McDonald consults with companies and organizations that are trying to understand how the transition to electric vehicles will impact their business and but also provide opportunities for growth. A core focus is understanding the key factors that will... Read More →


Wednesday November 3, 2021 8:30am - 10:00am CDT
Room 200A&B

10:00am CDT

Electronics Exhibition
See full exhibitor listing and floorplan here: https://smta.org/mpage/smtai-floorplan

Wednesday November 3, 2021 10:00am - 5:00pm CDT
Exhibit Hall

11:00am CDT

APT1: Assembly Process & Materials 1
Chair: Pradeep Lal, Ph.D., Auburn University

>>Innovative Indium and Silver-Tin Plating Processes for Connector Press-Fit Applications
Frank Xu, Ph.D., Macermid Alpha Electronics Solutions

>>Micro Device Hot Solder Dip: Assessing the Validity of Self-Mitigation in Micro Components
Phil Myers, Retronix Ltd

>>No Bleed Die Attach to Roughened Leadframe
Dan Hart, MacDermid Alpha Electronics Solutions

Speakers
FX

Frank Xu, Ph.D.

MacDermid Alpha Electronics Solutions
DH

Dan Hart

MacDermid Alpha Electronics Solutions
PM

Phil Myers

Retronix Ltd


Wednesday November 3, 2021 11:00am - 12:30pm CDT
Room 202 A&B

11:00am CDT

LTS1: Microstructure and Properties of LTS
Chair: Jim Wilcox, Universal Instruments

>>Effect of Initial Volume Ratio, Reflow Temperature and Current Stressing on the Microstructure of SnBiAg-SAC Mixed Solder Joints
*Eric Cotts, Binghamton University

>>Mechanical Strength – Low Melting Temperature Alloy Test
Lars Bruno, Ericsson AB

>>The Variation of the Electrical Resistance and Microstructure of SnBi based Solder Joints with Current Stressing
Faramarz Hadian, Ph.D., Binghamton University

Speakers
EC

Eric Cotts, Ph.d.

Binghamton University
LB

Lars Bruno

Product Engineer, Ericsson AB
FH

Faramarz Hadian

Binghamton University


Wednesday November 3, 2021 11:00am - 12:30pm CDT
Room 200 E

11:00am CDT

MFX5: Advanced Materials and Devices
Chair: Eric Campbell, IBM Corporation

>>Varying Requirements, same Inkjet Solder Mask Coating Tool - The case of Inkjet Adaptability by Printing Strategies
Don Veri, SUSS MicroTec NL

>>New Device Validates Printer Accuracy and Squeegee Force Capability During Singular Test
Michael Sivigny, CeTaQ Americas

>>Thin Foil Printing in Today’s Miniaturized World: Do Printing Rules Change?
*Chrys Shea, Shea Engineering Services

Speakers
avatar for Michael Sivigny

Michael Sivigny

General Manager, CeTaQ Americas
CS

Chrys Shea

President, Shea Engineering services
SMT consultant with 30 years’ process engineering experience.


Wednesday November 3, 2021 11:00am - 12:30pm CDT
Room 200 D

11:30am CDT

Electric Vehicles Round Table Discussion: Fad, Fantasy, or Fortune in SMT? (Open to the Public)
Panelists:
Loren McDonald, EVadoption
Debbie Carboni, KYZEN Corporation
Brian O’Leary, Indium Corporation

Whether it’s the endless wonders of Tesla or a multibillion-dollar recall of GM’s Bolts, electric vehicles (EVs) are in the news almost every day now for reasons both good and bad. But electric vehicles have actually been around since the 1800s, so why the sudden interest?

This EV roundtable will discuss the emerging EV market: why it hit an inflection point and how we should be responding. We’ll discuss opportunities for business growth and, more importantly, our responsibility as industry leaders to be good stewards in PCBA for automotive applications.
Come join SMTAI keynote speaker, Loren McDonald, and industry experts, Debbie Carboni and Brian O’Leary, for an educational and lively exchange on the emerging market of electric vehicles.

Speakers
avatar for Loren McDonald

Loren McDonald

CEO, EVAdoption, LLC
As CEO of EVAdoption, LLC, Loren McDonald consults with companies and organizations that are trying to understand how the transition to electric vehicles will impact their business and but also provide opportunities for growth. A core focus is understanding the key factors that will... Read More →
avatar for Debbie Carboni

Debbie Carboni

Global Product Manager, KYZEN Corporation
I love helping others!   Much of my time is helping OEM’s and their CM’s discuss "Design For Cleaning" & setting up their cleaning process to ensure reliability.  Solving problems helps us all learn!
avatar for Brian O'Leary

Brian O'Leary

Global Head e-Mobility & Infrastructure, Indium Corporation
I have worked in the electronics industry for almost 20 years and I have never been so excited about our industry and the positive role it will play in changing the world for generations to come. I believe material science will change the world in EV, e-Mobility and it's supportive... Read More →


Wednesday November 3, 2021 11:30am - 12:30pm CDT
Room 205C&D

2:00pm CDT

TI1: Thermal
Chair: Julie Silk, Keysight Technologies

>>High Performance Liquid Metal Thermal Interface Materials
Ron Lasky, P.E., Ph.D., Indium Corporation

>>GaIn Based Liquid Metals as TIMs: Challenges and Considerations
Peter McClure, Universal Instruments Advanced Process Laboratory

>>Photonic Soldering Temperature Sensitive Components with High Temperature Solder Alloys
Vahid Akhavan, NovaCentrix

Speakers
avatar for Ron Lasky, P.E., Ph.D.

Ron Lasky, P.E., Ph.D.

Indium Corporation
PM

Peter McClure

Universal Instruments’ Advanced Process Laboratory
VA

Vahid Akhavan

NovaCentrix


Wednesday November 3, 2021 2:00pm - 3:30pm CDT
Room 203A&B

2:00pm CDT

APT2: Panel Discussion - Packaging for Automotive
Chair: Cheryl Tulkoff, NI
Moderator: Andrew Mawer, NXP Semiconductors

Panelists:
Pradeep Lall, Ph.D., Auburn University
Burt Carpenter, NXP Semiconductors
Rajesh Sur, Qorvo
Chuck Woychik, Ph.D., SkyWater Technology

Automotive platforms increasingly use electronics for a number of function-critical and safety critical functions including guidance, navigation, control, charging, sensing and operator interaction. The automotive platforms have evolved over the last two decades to include hybrid electric vehicles and fully-electric vehicles. Much of the electronics resides under the hood of the car, where the temperatures and vibration-levels are much harsher than experienced in consumer office-benign applications. The space of packaging applications has continued to evolve through the emergence of new packaging architectures to enable for advanced computing on mobile automotive platforms. In addition, new materials and integration processes have emerged to allow for ever tighter integration of electronics sensing and processing into the structural features of the automotive body. The real-time environment for enablement of advanced features creates a set of challenges unique to the automotive platform.
The panel is constituted of a team of subject-matter experts from industry and academia who will talk about the challenges related to packaging in challenging automotive applications.



Wednesday November 3, 2021 2:00pm - 4:00pm CDT
Room 202 A&B

2:00pm CDT

LTS2: Reliability Testing (1)
Chair: Eric Cotts, Binghamton University

>>The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of Hybrid Low Temperature Solder Joints
*Richard Coyle, Ph.D., Nokia Bell Labs

>>Interim Thermal Cycling Report on Hybrid and Homogeneous LTS Solder Joints
*Richard Coyle, Ph.D., Nokia Bell Labs

>>Mechanical Shock Testing And Failure Analysis On Mixed SnAgCu-BiSn And Full Stack BiSn Solder Joints Of CABGA192 Components
Raiyo Aspandiar, Ph.D., Jagadeesh Radhakrishnan, Intel Corporation

>>Thermal Reliability of Mixing Bismuth Containing Solder Paste with SAC BGA's at Low Reflow Temperature- Part II
Sahana Marur Kempaiah, Rochester Institute of Technology



Speakers
RC

Richard Coyle, Ph.D.

Nokia Bell Labs
JR

Jagadeesh Radhakrishnan

Intel Corporation
SM

Sahana Marur Kempaiah

Rochester Institute of technology


Wednesday November 3, 2021 2:00pm - 4:00pm CDT
Room 200 E

2:00pm CDT

MFX6: Material Performances
Chair: Keith Bryan, KB Consultancy

>>What Do You Want on Your Tombstone?
*Tony Lentz, FCT Assembly

>>Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance
Morgan Miller, Insituware

>>Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration
Evan Griffith, Indium Corporation

>>Impact Of The Surface Finish On IMC And Solder Joint Reliability With Low-Temperature Solder Paste
Joe McGurran, Atotech USA, LLC; Britta Schafsteller, Atotech Deutschland GmbH

Speakers
TL

Tony Lentz

FCT Assembly
MM

Morgan Miller

Insituware
EG

Evan Griffith

Indium Corporation
JM

Joe McGurran

Atotech USA


Wednesday November 3, 2021 2:00pm - 4:00pm CDT
Room 200 D
 
Thursday, November 4
 

7:30am CDT

Registration Opens
SMTA International Registration: Tuesday, November 2 - Thursday, November 4
7:30am-5:00pm
Foyer of Hall B  

Thursday November 4, 2021 7:30am - 5:00pm CDT
Hall B

8:30am CDT

APT3: Assembly Process & Materials 2
Chair: Ross Wilcoxon, Collins Aerospace
Co-Chair: Andrew Mawer, MXP Semiconductors

>>CPU Socket Interposer Component Level and Manufacturability Study, Part 1: Socket Contact vs. Direct-Solder-Attach Interconnection
*Paul Wang, Mitac International Corporation

>>Underfill Material and Interface Property Evolution in Underhood Automotive Temperatures over Period of 1-Year
*Pradeep Lall, Ph.D., Aurburn University

Speakers
PW

Paul Wang

Mitac International Corporation
PL

Pradeep Lall

Auburn University


Thursday November 4, 2021 8:30am - 10:00am CDT
Room 202 A&B

8:30am CDT

LTS3: Assembly and Manufacturing Considerations with LTS (1)
Chair: Phil Isaacs, IBM Corporation

>>Enabling Pin in Paste Through Hole Soldering Through SnBi Low Temperature Solder
Sugadh Bakare, Intel Corporation

>>Unveiling a Total Solution for Soldering Through-hole Components using a Low Temperature Alloy
Anna Lifton, MacDermid Alpha Electronics Solutions

>>Using a Low Melting Point Solder in a Selective Soldering Process
Eddia Groves, Jonathan Wol, Pillarhouse USA, Inc.

Speakers
SB

Sugadh Bakare

Intel Corporaiton
PC

Pritha Choudhury, Ph.D.

R&D manager, MacDermid Alpha Electronics Solutions
EG

Eddie Groves

Pillarhouse USA, Inc.


Thursday November 4, 2021 8:30am - 10:00am CDT
Room 200 E

8:30am CDT

TI2: Digital Transformation
Chair: Marie Cole, IBM Corporation (Retired)

>>Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory
Ivan Aduna, Koh Young America, Inc.

>>Systems Analysis and Axiomatic Design Using Discrete Event Simulation
Zohair Mehkri, Flex

>>SMT Performance Analytics - Golden Cycle Time and Automated Loss Reason Inference
Andrew Scheuerman, Ph.D., Arch Systems

Speakers
IA

Ivan Aduna

Koh Young America, Inc.


Thursday November 4, 2021 8:30am - 10:00am CDT
Room 203A&B

10:00am CDT

Electronics Exhibition
See full exhibitor listing and floorplan here: https://smta.org/mpage/smtai-floorplan

Thursday November 4, 2021 10:00am - 4:00pm CDT
Exhibit Hall

10:30am CDT

LTS4: Assembly and Manufacturing Considerations with LTS (2)
Chair: Randy Schueller, Ph.D., Dell

>>Manufacturing Cost Reductions Available When Using Low MP Solder Paste
Mitch Holtzer, Alpha Assembly Solutions

>>The Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/Growth
*David Hillman, Collins Aerospace

>>Hybrid Assembly and Reliability of Conventional Pb-Free BGA’s Using Low Temperature Solder Paste for Temperature Sensitive IC Applications
*Andrew Mawer, NXP Semiconductors

Speakers
MH

Mitchell Holtzer

Alpha Assembly Solutions
avatar for David Hillman

David Hillman

Collins Aerospace
AM

Andrew Mawer

NXP Semiconductors


Thursday November 4, 2021 10:30am - 12:00pm CDT
Room 200 E

10:30am CDT

APT4: Package Performance and Reliability
Chair: Kim Cho, Collins Aerospace
Co-Chair: Chuck Woychik, Ph.D., Skywater Technology 

>>Automotive Gate Driver Package with Galvanically Isolated Communication Linkage
*Burton Carpenter, NXP Semiconductors

>>Modeling of the Effect of Thermal Pad Voiding on Quad Flatpack No-Lead Components
Ross Wilcoxon, Ph.D., Collins Aerospace

>>Additive-Print Process-Performance Interaction for Ink-Jet and Direct-Write Circuits with Surface Mount Components
*Pradeep Lall, Ph.D., Auburn University

>>An Approach to Use Reduced Sample Sizes for Qualification Testing Based on Failures in Time (FITS) Analysis and the Poisson Exponential Binomial Distribution for Low Volume Custom Components
Jacob Weber, Collins Aerospace

Speakers
BC

Burton Carpenter

Engineer, NXP Semiconductors
avatar for Ross Wilcoxon, Ph.D.

Ross Wilcoxon, Ph.D.

Collins Aerospace
JW

Jacob Weber

Collins Aerospace
PL

Pradeep Lall

Auburn University


Thursday November 4, 2021 10:30am - 12:30pm CDT
Room 202 A&B

10:30am CDT

TI3: Process Transformation
Chair: Greg Vance, Rockwell Automation

>>An Automated PCB Design Constraint Extraction and Verification from the SOC Platform Design Collateral
Alan Hatfield, Intel Corporation; Minoru Ishikawa, Siemens Digital Industries Software

>>Aerosol Jet Printed Interconnects For Millimeter-wave Components Aerosol Jet Printed Interconnects For Millimeter-wave Components
Bryan Germann, Optomec

>>An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in Re-Work Applications
Dan Jenkins, Steel Camel

>>Improving Immersion Silver Performance for 5G Applications
Denis Jacques, Technic Inc.

Speakers
AH

Alan Hatfield

Intel Corporation
DJ

Dan Jenkins

Steel Camel
DJ

Denis Jacques

Technic Inc


Thursday November 4, 2021 10:30am - 12:30pm CDT
Room 203A&B

1:30pm CDT

HE1: Challenges and Durability
Chair: Gary Tanel, Electronics Alliance

>>Challenges of Interpreting and Applying New IPC J-STD-001 Cleanliness Standards in High-Rel Applications
*Bill Capen, Honeywell FM&T

>>Effect of Temperature on the Mechanical Fatigue of Solder Joints in Ball Grid Array Assembly
Xin Wei, Auburn University

>>Electrical Performance Impact of Disinfecting Near and Around Electronic Systems
*Phil Isaacs, IBM Corporation

Speakers
BC

Bill Capen

Honeywell FM&T
XW

Xin Wei

Auburn University
PI

Phil Isaacs

IBM Corporation


Thursday November 4, 2021 1:30pm - 3:00pm CDT
Room 202 A&B

1:30pm CDT

INS1: Inspection and Test
Chair: Michael Konrad, Aqueous Technologies

>>A New X-Ray Tube Technology to Revolutionise Electronics Inspection
*Keith Bryant, KB Consultancy

>>SIR Glass Test Vehicle Designed to Characterize Process Materials
*Mike Bixenman, DBA, Magnalytix

>>Head on Pillow Defect Detection Using AI Machine Learning
Ajay Chaddha, Ph.D., Intel Corporation

Speakers
KB

Keith Bryant

KB Consultancy


Thursday November 4, 2021 1:30pm - 3:00pm CDT
Room 203A&B

1:30pm CDT

LTS5: Reliability Testing (2)
Chair: Dale Lee, Plexus Corp.

>>Solder Ball Drift Behavior of Hybrid SnAgCu‐LTS Solder Interconnects in Accelerated Thermal Cycling
Luke Wentlent, Jim Wilcox, Universal Instruments Corporation

>>Challenges To Maintain High Electrical Reliability Of Low Temperature Solder Paste
Ramakrishna Hosur Venkatagiriyappa, Ph.D., MacDermid Alpha Assembly Solutions

>>Thermal Cycling Behaviors of Hybrid and Homogeneous Low Temperature Solder Interconnects
Luke Wentlent, Jim Wilcox, Universal Instruments Corporation

Speakers
LW

Luke Wentlent

Universal Instruments Corporation
RH

Ramakrishna Hosur Venkatagiriyappa, Ph.D.

MacDermid Alpha Assembly Solutions


Thursday November 4, 2021 1:30pm - 3:00pm CDT
Room 200 E
 
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